http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201111790-A

Outgoing Links

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-04
filingDate 2009-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_079cb0dc8719c0e852c1730677865c0f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_545a61ddf0f0674ecd30b376b44e2f2a
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publicationDate 2011-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201111790-A
titleOfInvention High-frequency vertical probe card structure
abstract A high-frequency vertical probe card structure, including at least one probe and a top-down stacked circuit board, a first insulating material, a conductive material body, and a second insulating material, the probe penetrates the first insulating material, the conductive material body and the second insulating material and exposes the probe tip to contact the test points of the chip under test, the connection section of the probe connects to the circuit board to enable the probe to conduct high-frequency electrical signals between the circuit board and the test points, the probe body is surrounded by the conductive material body, and a gap exists between the probe and the conductive material body, so that the probe body can use air as the medium to provide the probe body with low dielectric conduction, thereby enhancing transmission quality of the high-frequency electrical signals and increasing test accuracy of the chip under test.
priorityDate 2009-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 20.