http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201111106-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B28D5-00
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filingDate 2010-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c51eac757c7fe3451d2a01a113f16caf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b6f2cc42ff1a57c49085695b3bf4123
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publicationDate 2011-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201111106-A
titleOfInvention Diamond wire saw, process for manufacturing diamond wire saw
abstract The present invention is to provide a diamond wire saw and a process for manufacturing diamond wire saw, wherein the said diamond wire saw is formed by coating the whole outside surface of core wire made of metal, in which diamond abrasive particles are dispersively maintained with the coating layers. The said coating layers are nickel alloy having tungsten, have sufficient hardness and then have great sharpness being used and are hard to be broken. Besides, the present invention is to provide another diamond wire saw and a process for manufacturing diamond wire saw, which comprises coating the whole outside surface of diamond wire saw formed of coating layers and diamond abrasive particle with metal film, and the diamond abrasive particles dispersively maintained in the outside surface of core wire made of metal have high retentivity, and there is no detriment to its sharpness while is used.
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priorityDate 2009-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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