http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201109402-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8a093119144f3a1c3ca31b228e7cdc94 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 |
| filingDate | 2009-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4f1f874b7392ae550527f4a5289037c7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_042b38a5e6937be8b459c1303bc40ceb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5af4b985524e053e76e09183e7275749 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d4b8942f9bb07964bd55015590da83a |
| publicationDate | 2011-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201109402-A |
| titleOfInvention | A method for preparing a high thermal conductivity and low dissipation factor adhesive varnish for build-up additional insulation layers |
| abstract | A method for preparing a high thermal conductivity and low dissipation factor adhesive varnish for build-up additional insulation layers is disclosed, where the adhesive varnish is used for high-density interconnected printed circuit boards or package substrates. The method comprises steps of: selecting at least two epoxy resins from a group including a tri-functional epoxy resin, a rubber-modified or Dimmer-acid-modified epoxy resin, a bromide-contained epoxy resin, a halogen-fee/phosphorus-contained epoxy resin, a halogen-free/phosphorus-free epoxy resin, a long-chain/halogen-free epoxy resin, and a bisphenol A (BPA) epoxy resin; adding selected epoxy resins into a pre-treatment vessel with a certain ratio; heating and mixing them well to form an epoxy resin precusor; cooling the epoxy resin precursor; during the cooling process, adding a solvent to the epoxy resin precursor to adjust the viscosity of the epoxy resin precusor; adding a bi-hardener solution, a catalyst, a solvent, and a flow modifier and mixing them well with the epoxy resin precursor; adding an inorganic filler with high thermal conductivity and mixing it with the mixture in vacuum to obtain a suitable viscosity value; and leaving the mixture undisturbed for a period of time to form the high thermal conductivity and low dissipation factor adhesive varnish for build-up additional insulation layers. |
| priorityDate | 2009-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 68.