http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201108903-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b01607e705336d4c0de8b9ac5f932497 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0568 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09509 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1383 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-108 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1461 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0191 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate | 2010-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a46a31a82cb605634deb5f2ccd8e1d6f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a106c7e016404cfc4d2d10c23c69dc0e |
| publicationDate | 2011-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201108903-A |
| titleOfInvention | Printed wiring board and method for producing the same |
| abstract | A process for manufacturing a printed-wiring board having an insulating layer, circuit wirings formed from a metal foil on both surfaces of the insulating layer, and conductive paste filled in a via hole for electrically connecting the circuit wirings formed on both surfaces of the insulating layer. The process comprises steps of sticking a masking film on the surface of the circuit wiring on one side of the insulating layer, projecting a first laser beam onto the surface of the stuck masking film to form an aperture through the masking film and through the circuit wiring on one side of the insulating layer, projecting a second laser beam having a spot-diameter larger than the diameter of a ridgeline of a rise caused around the aperture in the masking film to form the via hole through the insulating layer, and filling the conductive paste into the via hole for electrically connecting the circuit wirings. |
| priorityDate | 2009-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.