http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201104020-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0428b61940012626ef330227fb205754 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C02F101-20 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C02F1-469 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G1-36 |
| filingDate | 2009-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5eb889aa4be753a14fb7223f0ac3ed7a |
| publicationDate | 2011-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201104020-A |
| titleOfInvention | Methods for treating copper-containing spent etching solution and regenerating etching solution |
| abstract | A method for treating copper-containing spent etching solution is provided. In an electrodialysis step, copper ions and ammonium ions are removed from the copper-containing spent etching solution to obtain a solution with a low copper concentration (≤ 1 ppm). In a reduction step, the removed copper ions are reduced to produce copper and/or cuprous oxide, and the removed ammonium ions are reduced to produce ammonia gas. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/RU-2620228-C1 |
| priorityDate | 2009-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 68.