patent/TW-201101429-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201101429-A

Outgoing Links

Predicate	Object
assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54453 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0102 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81801 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81193 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05009 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13184 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05139 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05124 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13083 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11901 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05548 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54493 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05184 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05655 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05644 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05639 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13124 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05571 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0557 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1308 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19043 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13155 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68372 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13139 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02372 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02351 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0231 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3511
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
filingDate	2010-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fbdcc63998393cf001f7be59c5315c13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3ca7ba1c1a92e28816e954ab6a81b15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c079119d7cb1b97551c6a9f5a6c59aeb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7cec2d3a249675009d79cceab3b5f3c
publicationDate	2011-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	TW-201101429-A
titleOfInvention	Improving the formation for TSV backside interconnects by modifying carrier wafers
abstract	An integrated circuit structure includes a semiconductor wafer, which includes a first notch extending from an edge of the semiconductor wafer into the semiconductor wafer. A carrier wafer is mounted onto the semiconductor wafer. The carrier wafer has a second notch overlapping at least a portion of the first notch. A side of the carrier wafer facing the semiconductor wafer forms a sharp angle with an edge of the carrier wafer. The carrier wafer has a resistivity lower than about 1x10<SP>8</SP> Ohm-cm.
priorityDate	2009-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341

Total number of triples: 94.