http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201044653-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_74851f38b5e581a2ea067455a676f5fc |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-64 |
| filingDate | 2009-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecb3203c5118a923782008e00a17ddb5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa6d8acd195268b01a85053d41e63d52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5858a3bc587177a151c1f632d8e9e8de |
| publicationDate | 2010-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201044653-A |
| titleOfInvention | Power LED thermal dissipation substrate and method for manufacturing power LED products and products thereof |
| abstract | The present invention provides a power LED substrate having a sunken hole and a heat sink structure and the method for manufacturing power LED products and the products thereof. It overcomes the existing power LED products that have several disadvantages including: increased process complexity, low productivity, high production costs, poor thermal conductivity, low reliability, and difficulties to test and mount. The method for manufacturing the power LED thermal substrate includes the following steps: a) selecting substrate material and processing the same, b) manufacturing heat sinks, and c) assembling the substrate and heat sinks. The method for manufacturing the power LED products of the present invention, based on the thermal substrate manufacturing method, includes the following steps: die bond process with chips, gold wire bonding, encapsulation molding, secondary hardening, device separation, and test, sorting and taping. The invention method is simple and has low production costs and high production efficiency. The power LED products of the present invention have the advantages such as high reliability, good quality, quality luminous, low cost, and simplicities to test and mount, and are especially suitable for large-scale production and applications. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8888328-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I566438-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9406842-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112060467-A |
| priorityDate | 2009-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.