| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-32 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-30 |
| filingDate |
2010-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_279b19ee73ef9c5917d2c5084b13e51b |
| publicationDate |
2010-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201043737-A |
| titleOfInvention |
Electrolytic tin plating solution and electrolytic tin plating method |
| abstract |
A tin plating solution and tin plating method for chip components minimizes tin shavings when plated components are rubbed together such as during bulk mounting. This minimizes sticking of the chip components together. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9067800-B2 |
| priorityDate |
2009-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |