| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad2afaa30d5877bd844cc746db821920 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0272
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49139
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49117
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10378
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0278
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1572
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1194
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1105 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-462
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 |
| filingDate |
2010-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_932a9173723d61f04d40bc475a5ed09f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc615e27b9615fb2524a6388a923d952
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb9db0ad8f275d495288674b5ae1b70f |
| publicationDate |
2010-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201043109-A |
| titleOfInvention |
Multilayer wiring substrate producing method and multilayer wiring substrate obtained by the same |
| abstract |
Disclosed is a multilayer wiring substrate producing method comprised of a process of drilling a prepreg by laser processing to form a via hole; a process of filling the via hole with conductive paste containing resin components and metal powders; and a process of pressing copper foils or copper foil portions of a patterned substrate, which are disposed on the upper and lower portions of the conductive paste. In the multilayer wiring substrate producing method, an alloy-type paste wherein at least a part of the metal powders are melted and the adjacent metal powders are alloyed is used as the conductive paste. In the prepreg, when the storage elastic modulus at an inflection point at which the storage elastic modulus is changed from an increase to a decrease is designated by A, and the storage elastic modulus at an inflection point at which the storage elastic modulus is changed from a decrease to an increase is designated by B in a temperature profile wherein the temperature increases from 60 DEG C to 200 DEG C, the ratio A/B is 10 or more before preliminary heating. The ratio A/B is decreased to less than 10 by preliminary heating before the drilling process, so that the multilayer wiring substrate is excellent in conductivity and stability for a long time. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9215801-B2 |
| priorityDate |
2009-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |