http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201042757-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14636 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1464 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-146 |
| filingDate | 2010-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3046aa8af7c6ee20d82a52946651158f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_80b4a94cd8e2903425f52fea986a6a4a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_120eb47d21b34ef9e8b55fad42db900c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d310fd2525f8fb4d7f15e8ef685405f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c9cbe3f7248e6950215bc2f6497a3eb |
| publicationDate | 2010-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201042757-A |
| titleOfInvention | Image sensor device and method of fabricating the same |
| abstract | A semiconductor image sensor device includes first and second semiconductor substrates. A pixel array and a control circuit are formed in a first surface of the first substrate. An interconnect layer is formed over the first surface of the first substrate and electrically connects the control circuit to the pixel array. A top conducting layer is formed over the interconnect layer to have electrical connectivity with at least one of the control circuit or the pixel array via the interconnect layer. A surface of a second substrate is bonded to the top conducting layer. A conductive through-silicon-via (TSV) passes through the second substrate, and has electrical connectivity with the top conducting layer. A terminal is formed on an opposite surface of the second substrate, and electrically connected to the TSV. |
| priorityDate | 2009-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.