| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4246
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-027 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06 |
| filingDate |
2010-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da1ac94bd4b2a0f0956ed03d835a39ac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8ce14d57c22ac7419b44969604a6fb5 |
| publicationDate |
2010-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201042386-A |
| titleOfInvention |
Photo-curable and heat-curable resin composition |
| abstract |
Disclosed are: a photo-curable and heat-curable resin composition which enables the formation of a cured coating film having significantly superior insulation reliability and also having PCT resistance, HAST resistance and electroless gold plating resistance that are important for a solder resist for a semiconductor package; a dried film and a cured product of the composition; and a printed circuit board having, formed thereon, a cured coating film such E.g., a solder resists produced from the composition or the dried film. Specifically disclosed is a photo-curable and heat-curable resin composition which can be developed with a dilute aqueous alkaline solution. The resin composition comprises a carboxyl-group-containing resin Excluding a carboxylgroup-contain~ng resin produced using an epoxy resin as a starting raw materials, a photopolymerization initiator and an epoxidized polybutadiene. The carboxyl-group-containing resin preferably contains no hydroxy group, and more preferably contains a photosensitive group. |
| priorityDate |
2009-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |