http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201041930-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_64f5f4fed6646de4e6f4b85e24a9e5cd http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9ef04181f8c5aa860984b229129b12c2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L35-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3417 |
| filingDate | 2009-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b8587771ca390bdc98c5006a3c9c6bd2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_78ddeb198215e9f8019d78483be5a919 |
| publicationDate | 2010-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201041930-A |
| titleOfInvention | Thermosetting resin composition and application |
| abstract | The invention discloses a thermosetting resin composition, comprising the following compounds: bifunctional group or multiple functional group epoxy resin, styrene-maleic anhydride copolymer SMA taken as a curing agent, wherein the molar ratio of styrene/maleic anhydride is 5 to 12:1, low bromine or high bromine BPA type epoxy resin or four bromine bisphenol A taken as a flame retardant, a promoter and a solvent. The resin composition of the invention has an extremely low dielectric performance, higher thermal reliability and better toughness after solidification, and the copper clad laminate made of the resin composition and reinforced materials such as glass fabrics has an extremely low dielectric constant and medium loss factor, high Td and better toughness and good processability for PCB circuit boards, is suitable for producing copper clad boards for PCB circuit boards and semi-solidified sheets and can be applied to common purposes of epoxy resins such as molding resins and so on and composite materials for construction, automobiles and aviation. |
| priorityDate | 2009-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 143.