| abstract |
The present invention provides a film with metal layer for electronic parts, which has an adhesive layer having excellent adherence to metal, and has excellent productivity; a process for producing the same and the use thereof. The film with metal layer for electronic parts of the invention, provided on at least one side of a resin film, is adhered to a metal layer by an intermediate adhesive layer, in which the adhesive layer comprises ethylene-unsaturated carboxylic acid copolymer or its metal salts. |