http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201040235-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e0bf0928b608797b70bbc2b91c7e52e |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate | 2010-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c68f53120f7e30ab49a85e081a0adc43 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_927d5086fe15f616e478f62b207eedd5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb3d64cda0b6cda0b579986e2ed52719 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_304140006dd55611a7d54e6052089df6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a94e945a56a29bb7ae1a3d2d89e0ae42 |
| publicationDate | 2010-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201040235-A |
| titleOfInvention | An aqueous polishing agent and its use in a process for polishing patterned and unstructured metal surfaces |
| abstract | An aqueous CMP agent, comprising (A) solid polymer particles interacting and forming strong complexes with the metal of the surfaces to be polished; (B)a dissolved organic non-polymeric compound interacting and forming strong water-solube complexes with the metal and causing an increase of the material removal rate MRR and the static etch rate SER with increasing concentration of the compound (B); and (C) a dissolved organic non-polymeric compound interacting and forming slightly soluble or insoluble complexes with the metal, which complexes are capable of being adsorbed by the metal surfaces, and causing a lower increase of the MRR than the compound (B) and a lower increase of the SER than the compound (B) or no increase of the SER with increasing concentration of the compound (C); a CMP process comprising selecting the components (A) to (C) and the use of the CMP agent and process for polishing wafers with ICs. |
| priorityDate | 2009-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 76.