| abstract |
[Issue] A resin composition is provided for forming a resin of an insulating layer of multilayered printed circuit boards to have excellent adherence with the conducting layer after an environmental test is accelerated. [Solution means] A resin composition for multilayered printed circuit boards comprises: (A) cyanate resin, (B) epoxy resin, (C) thermoplastic resin, (D) talc, and (E) silica. When the non-volatile constituent in the resin composition is 100 percent by mass, the total content of the constituent (D) and the constituent (E) is 35 percent by mass to 60 percent by mass, and the content of the constituent (D) as talc is 5 percent by mass to 20 percent by mass. |