| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad96d4cea59caf1e1fd0668d41a1d6ca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8c1198e15e220fa9f3a5c186b6b1762e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C13-00 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-36 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26 |
| filingDate |
2010-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abdf80913da96bf2fefd1a6989464f0c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_49c45eb7877b30af37b47b853111ccdf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c80d4da185e437d50e422377d9b411d9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e9488370f943ff0f4aad233817a3e97 |
| publicationDate |
2010-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201039961-A |
| titleOfInvention |
Lead-free solder alloy, fatigue-resistant soldering materials containing the solder alloy, and joined products using the soldering materials |
| abstract |
Provided are a low-silver lead-free solder alloy which has excellent wetting properties and excellent thermal fatigue characteristics; a solder-paste type soldering material and a flux-cored soldering material which exhibit excellent fatigue resistance; and joined products using the soldering materials. The soldering materials are characterized by being prepared either by mixing a low-silver lead-free solder alloy with a pasty flux, or by forming the solder alloy into a wire with a solid or pasty flux as the core, said low-silver lead-free solder alloy containing Cu: 0.1 to 1.5wt%, Co: 0.01 to less than 0.05wt%, Ag: 0.05 to 0.25wt%, and Ge: 0.001 to 0.008wt% with the balance being Sn. |
| priorityDate |
2009-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |