http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201039702-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b1784eb7fc902d292db30e120ec712d5 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0307 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-605 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-617 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate | 2010-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a19c4655270446b2f6f761eb31468848 |
| publicationDate | 2010-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201039702-A |
| titleOfInvention | Copper foil for printed wiring board and method for producing same |
| abstract | Disclosed is a copper foil for a printed wiring board, which is characterized by comprising, on at least one surface thereof, a roughened layer that is composed of needle-like fine roughening particles each having a diameter of 0.1-2.0 [μ]m and an aspect ratio of not less than 1.5. Also disclosed is a method for producing a copper foil for a printed wiring board, which is characterized in that a roughened layer that is composed of needle-like fine roughening particles each having a diameter of 0.1-2.0 [μ]m and an aspect ratio of not less than 1.5 is formed on at least one surface of a copper foil, using an electrolytic bath that is composed of sulfuric acid/copper sulfate and contains at least one substance selected from among an alkyl sulfate salt, tungsten ions and arsenic ions. Consequently, a copper foil for a semiconductor package substrate, which is capable of preventing circuit erosion without deteriorating the other characteristics of the copper foil, can be obtained. In particular, a copper foil for a printed wiring board, which has an improved roughened layer and is thus increased in adhesion strength to a resin, can be obtained. The method for producing a copper foil for a printed wiring board enables the production of such a copper foil. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103857833-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102277605-A |
| priorityDate | 2009-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 56.