http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201035242-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0755 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-075 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F267-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 |
| filingDate | 2010-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98edd2c343b9fe70f3c9ec088290e7e3 |
| publicationDate | 2010-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201035242-A |
| titleOfInvention | Positive-type photosensitive resin composition, and cured film, protective film, insulating film, semiconductor device and display device each using the positive-type photosensitive resin composition |
| abstract | The present invention relates to a positive-type photosensitive resin composition, capable of reducing the warpage of a substrate such as a semiconductor wafer even when applying thermal history to a substrate such as a semiconductor wafer, which is patterned by applying thereto a positive-type photosensitive resin composition containing a polyamide resin having a polybenzoxazole precursor as a main component, exposure and developing, to conduct a ring-closing dehydration; a cured film obtained by ring-closing dehydration of the positive-type photosensitive resin composition containing a polyamide resin having a polybenzoxazole precursor as a main component; and a protective film, insulating film, semiconductor device and display device having the cured film. The positive-type photosensitive resin composition of the present invention comprises a polyamide resin (A) and a photosensitizing agent (B), wherein the polyamide resin comprises a repeating unit (A-1) represented by a general formula (1) and a repeating unit (A-2) represented by a general formula (2) and/or a repeating unit (A-3) represented by a general formula (3). |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8703367-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I468868-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8841064-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9176381-B2 |
| priorityDate | 2009-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 88.