| abstract |
Disclosed is a semiconductor device which comprises either a lead frame having a die pad or a circuit board, one or more semiconductor elements mounted on either the die pad provided on the lead frame or the circuit board, a copper wire that electrically connects an electrically connecting part provided on the lead frame or the circuit board to an electrode pad provided on the semiconductor element, and a sealing material that seals the semiconductor element and the copper wire. In the semiconductor device, the combination of the electrode pad and/or the sealing material and the copper wire has predetermined characteristics. |