http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201030905-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5dabfc7998cca69e04571256e5cb4e80 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16151 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28 |
| filingDate | 2009-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1cfcaba054892ec23ea8b98cfdcacae6 |
| publicationDate | 2010-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201030905-A |
| titleOfInvention | Package structure and a cover thereof |
| abstract | A package structure is disclosed, including a carrier board having a semiconductor disposed thereon; an aluminum material having opposing first and second surfaces, the first surface having at least a recess formed therein having a bottom surface and an adjacent inner side surface, the first surface of the aluminum material connecting with the carrier board for receiving the semiconductor element in the recess; and a surface layer formed on the outer surface of the aluminum material. The invention is characterized by employing the aluminum board that is more solid and enduring to the effects of various environmental variables such as humidity and temperature and also capable of preventing electromagnetic interference, thereby maintaining dimensions of the package structure and enhancing shielding effect thereof. |
| priorityDate | 2009-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.