http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201030821-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_826c85c7a9a2785b1abfe8b5aa8ac509 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E10-547 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-022425 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-068 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-283 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-0224 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-18 |
| filingDate | 2009-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eaf0bb4f25a7bd03a15157c6db7b4bdb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9eff3010c1357bdf0c067b07eb949a67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57afb5a6a4aec51d3064b43e7d05c469 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad7d03e10f93175d0f2c69a0930b2dae http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7e31ec1dc9b488fd60e8a39252f23cb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12d69423f193e37590229ecc38b9b3c5 |
| publicationDate | 2010-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201030821-A |
| titleOfInvention | Method for producing a metal contact on a semiconductor substrate provided with a coating |
| abstract | The invention relates to a method for producing an electrically conducting metal contact on a semiconductor component that comprises a coating (20) on the surface of a semiconductor substrate (12). In order to keep transfer resistances low while maintaining good mechanical strength, the following method steps are proposed: - applying a particle-containing fluid onto the coating, wherein the particles contain at least metal particles and glass frits, - curing the fluid while simultaneously forming metal areas (26, 28) in the substrate (12) through heat treatment, - removing the cured fluid and the areas of the coating covered by the fluid, - depositing, for the purposes of forming the contact without using intermediate layers, electrically conducting material (18) from a solution onto areas of the semiconductor component in which the coating is removed while at the same time conductively connecting the metal areas (26, 28) present in said areas on the substrate (12). |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I593832-B |
| priorityDate | 2008-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.