| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-092 |
| filingDate |
2009-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b497ef67fd69f797a78d88adf7112bfb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c517a4b62aa3fbf047bf09cbd9d26a1 |
| publicationDate |
2010-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201030082-A |
| titleOfInvention |
Thermoharding resin composition, dry film and printed circuit board and manufacturing method thereof |
| abstract |
A thermoharding resin composition capable of obtaining a resin insulation layer exhibiting desmear property and desmear resistance at the same time, and a dry film using the same, and a printed circuit board and the manufacturing method thereof. The thermohardening resin composition of the invention is characterized by containing: a phenol resin, a mixture containing an epoxy resin in a liquid form at 20 degrees Celsius and an epoxy resin in a solid form at 40 degrees Celsius, and an inorganic filling agent. The equivalent ratio of the phenolic hydroxy groups of the phenol resin to the epoxy groups of the foregoing mixture is 0.3 to 1.0. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I561572-B |
| priorityDate |
2009-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |