http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201028468-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-26
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filingDate 2009-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_174c28aaad4c52ca8bb2ac23a650ca82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b26e056d35f534401c78f022f20147c0
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publicationDate 2010-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201028468-A
titleOfInvention Composition for post chemical-mechanical polishing cleaning
abstract The present invention relates to a composition for post chemical-mechanical polishing (CMP) cleaning. The composition is alkaline, which can remove azole-type corrosion inhibitors on the wafer surface after CMP. This composition can effectively remove azole compounds, increase wettability of the Cu surface, and significantly improve the defect removal after CMP.
priorityDate 2009-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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