http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201027629-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336
filingDate 2009-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d0d6e14b17acabd4bedfd3b63a56891
publicationDate 2010-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201027629-A
titleOfInvention Method for fabricating a semiconductor device
abstract A method for fabricating a semiconductor device includes providing a substrate sequentially having a polysilicon layer and an insulating layer formed thereon; patterning the polysilicon layer and the insulating layer to form at least a gate structure on the substrate; forming lightly doped regions in the substrate respectively at two side of the gate structure; forming a spacer on a sidewall of the gate structure; forming barrier layers respectively on a top surface of the gate structure and surfaces of the substrate at two sides of the spacer, and forming a source/drain in the substrate respectively at two sides of the spacer.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111128885-A
priorityDate 2009-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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