http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201026175-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0120933550ea729b9f3186c3772531b
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
filingDate 2008-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6aac20a901991f070213a818ffed3c1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71962fd1f10cbf048b0c54f19b0dd9ef
publicationDate 2010-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201026175-A
titleOfInvention Multilayer printed circuit board and method for manufacturing same
abstract To provide a multilayer printed circuit board that can reduce manufacturing costs by reducing the number of components and has improved interlayer connection reliability, and to provide a method of manufacturing the multilayer printed circuit board. In the multilayer printed circuit board 10, a plurality of resin films 15 having a through-hole 11, a conductor pattern 12 formed on one surface, and a conductive through-hole 14 integrally formed with the conductor pattern 12 on the inner wall of the through-hole overlap in the same vertical direction. Conductors 23 subjected to intermetallic combination with the opposing conductor pattern 12 and conductive through-hole 14 are provided between two adjacent resin films in a plurality of resin films 15. Interlayer connection between the conductor patterns 12 of each resin film is performed via the conductive through-hole 14 integral with the conductor pattern 12 and the conductors 23 without interposing any separate resin films between two adjacent resin films.
priorityDate 2007-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5460839
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID448924711
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID132648035
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419583196
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID408499458
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID25501
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8929
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID451774801
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452292606
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID61436
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID450926304
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419522783
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID444305
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID4650
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452887606
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID104727

Total number of triples: 29.