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filingDate 2009-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1437b61fc59c1ad973f25e93dcad14a9
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publicationDate 2010-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201024354-A
titleOfInvention Resin composition, electronic component using the same and production method therefor
abstract Disclosed is a resin composition, which comprises a thermosetting resin contained therein in an amount of 40 volume% or more, and a wax contained therein in an amount of 5 to 30 volume%, wherein: the thermosetting resin exists in liquid form at room temperature; and the wax exists in powder form at room temperature and has a melting point of 70 to 150 DEG C, and wherein the resin composition has a viscosity of 50000 to 150000 mPa.s as measured at room temperature.
priorityDate 2008-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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