Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c186e9ae8cafab5df5c8d80cfa7b0fa1 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-0878 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02378 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-324 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02433 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-94 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02529 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-1608 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66068 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02447 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7802 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3003 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-6606 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-318 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-78 |
filingDate |
2009-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8668d63dee9e124a95fa546bfd2998f0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e9c8ada1c871f8bece78cc8999960699 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02d0ec9f94216fc8b72126451aefef62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b5083511aeef16853618b44808fd70f4 |
publicationDate |
2010-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-201021206-A |
titleOfInvention |
Silicon carbide semiconductor device and method for manufacturing the same |
abstract |
Disclosed are a silicon carbide semiconductor device having excellent electrical characteristics such as channel mobility and a method for manufacturing such a silicon carbide semiconductor device. A semiconductor device (1) comprises a silicon carbide substrate (2) having an off-angle of not less than 50 DEG but not more than 65 DEG with respect to the (0001) plane direction, a p-type layer (4) serving as a semiconductor layer, and an oxide film (8) serving as an insulating film. The p-type layer (4) is formed on the substrate (2) and composed of silicon carbide. The oxide film (8) is formed in contact with a surface of the p-type layer (4). The maximum value of the nitrogen atom concentration in the region within 10 nm from the interface between the semiconductor layer and the insulating film (namely, the interface between the channel region and the oxide film (8)) is not less than 1 1021 cm<SP>3</SP>. |
priorityDate |
2008-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |