http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201016762-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3dac5b2da61b8e2a02dcb395dea0aee3
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
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filingDate 2008-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_527ae408cc4ae15c1a6aa315cc23c25f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ccc56bdd454903a204c6ce3b8cef1f6
publicationDate 2010-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201016762-A
titleOfInvention Silver filled carbon nanotube and polyimide mixed film and manufacturing method thereof
abstract The invention relates to a silver filled carbon nanotube and polyimide mixed film and a manufacturing method thereof. The mixed film includes 0.7 to 1.5% of silver filled carbon nanotube and 98.5 to 99.3% of polyimide. The steps of the method of the mixed film includes: opening the carbon nanotube; mixing the carbon nanotube with a silver ion containing solution to introduce the silver ion containing solution into the hollow chamber of the carbon nanotube; sintering to obtain a silver filled carbon nanotube; mixing and reacting the silver filled carbon nanotube with diamines and diacid anhydrides to obtain the silver filled carbon nanotube and polyimide mixed film. The invention increases heat dissipation efficiency of flexible printed circuit boards and embedded passive components so as to increase the working efficiency of the passive components; and enhances the heat dissipation efficiency of the computer system so as to elevate the working efficiency and life of the computer system.
priorityDate 2008-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 29.