Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b01607e705336d4c0de8b9ac5f932497 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-382 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0162 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-455 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-106 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-10 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 |
filingDate |
2009-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1c462962a87f88310df531c36834d93b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a8ff63a3d4e193858507f2c43f71070 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_365be5832bf57afb6cddcf703378eddd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8cd85c71fecdd2163b9e36f37d542fd6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_053f0be38dfbd91c3fc0e32042871f6f |
publicationDate |
2010-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-201012851-A |
titleOfInvention |
Printed wiring board and method for manufacturing same |
abstract |
A printed wiring board having excellent plating resistance, wherein bleed-out of a cyclic dimethylsiloxane oligomer from a protective layer which is composed of a photosensitive siloxane polyimide resin composition is sufficiently suppressed. Specifically, a protective layer which is composed of a thermoset product of a photosensitive siloxane polyimide resin composition containing a siloxane polyimide resin, which is obtained by imidizing a tetracarboxylic acid dianhydride, a siloxane diamine having a diphenylsilylene unit and a diamine containing no siloxane, a crosslinking agent and a photoacid generator is formed on at least a part of a copper or copper alloy wiring pattern of a printed wiring board. A certain amount of at least one substance selected from the group consisting of liquid epoxy resins, benzoxazines and resols is used as the crosslinking agent, and a certain amount of the photoacid generator is used as a sensitizer. The surface of the copper or copper alloy wiring pattern of a printed wiring board has been subjected to a roughening treatment. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9353223-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I549991-B |
priorityDate |
2008-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |