| abstract |
A laminate wherein surface roughness of a cured material layer subjected to roughening can be decreased and bonding strength between the cured material layer and a metal layer can be increased. Specifically disclosed is a laminate (11) comprising a cured material layer (3A) which is formed as follows: after laminating a resin film on a substrate (12), the resin film is preliminarily cured at 100-200 DEG C, thereby forming a preliminarily cured material layer; and then the surface of the cured material layer is subjected to roughening at 55-80 DEG C. The resin film is composed of a resin composition containing an epoxy resin, a phenol curing agent, a curing accelerator, and a surface-treated substance obtained by surface-treating 100 parts by weight of an inorganic filler having an average particle diameter of 0.05-1.5 μm with 0.5-3.5 parts by weight of a silane coupling agent. The silane coupling agent has an epoxy group, an imidazole group or an amino group. |