http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201010042-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_234195d1eea4e802901db328a282d151 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-60 |
| filingDate | 2008-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_85dccdae28e2b4290a7b9d47c2944bc4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ccb3fac29cef14bf943e9e9a4d5257e9 |
| publicationDate | 2010-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201010042-A |
| titleOfInvention | Manufacturing method for a packaging structure of SIP module |
| abstract | A manufacturing method for a packaging structure of SIP includes following steps. First step is providing a substrate having electronic devices thereon. Second step is covering the electronic devices by the mixture of the molding compound and the precursor of the conductive polymer in order to form a molding structure. Third step is separating the individual electronic module. Fourth step is doping elements for transferring the precursor in the mixture into a conductive layer on the surface of the molding structure. Therefore, the manufacturing method is optimized for forming a shielding structure of the SIP module. |
| priorityDate | 2008-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 19.