http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201007869-A

Outgoing Links

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67
filingDate 2009-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fcb17cc64386d9eda0a033eadf56229d
publicationDate 2010-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201007869-A
titleOfInvention Substrate processing apparatus, heating device and semiconductor device manufacturing method
abstract Provided are a substrate processing apparatus and a semiconductor device manufacturing method. The substrate processing apparatus comprises a process chamber 12 configured to process a substrate 1. A heating element 39 is installed at a peripheral side of the process chamber 12. An annular inner wall 34 is installed at a peripheral side of the heating element 39. An annular outer wall 35 is installed at a peripheral side of the inner wall 34 with a space 36 being formed therebetween. An annular cooling member 60 is installed at the space 36 for cooling. An actuating mechanism 64 moves the cooling member 60 between a contact position where the cooling member makes contact with at least one of the inner wall 34 and the outer wall 35 and a non-contact position where the cooling member 60 does not make contact with any one of the inner wall 34 and the outer wall 35. A control unit 100 controls at least the actuating mechanism 64.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I404144-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I618150-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I408327-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I584379-B
priorityDate 2008-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 22.