| abstract |
The present invention provides a low temperature photosensitive resin composition which not only has excellent sensitivity, thermal resistance, chemical resistance and the like, but also can make a film have excellent hydrophobicity under 150 Deg C low-temperature working procedure; therefore, the composition is especially suitable for being used in banks formed by means of ink-jet and for lift-off use during the manufacturing process of OLED and OTFT elements. The present invention relates to a low temperature curing photosensitive resin composition, and particularly containing the following substances:(A)( i) unsaturated carboxylic acid, unsaturated carboxylic acid anhydride or mixture thereof,(ii) unsaturated compound containing epoxy group and(iii) acrylic acid co-polymer obtained by co-polymerization of olefin unsaturated compounds; (B) 1,2-quinonediazide compounds; (C) fluorine compounds; and(D) solvent having 90 to 150 Deg C boiling point and 0.3 to 1.0 evaporation speed when the evaporation speed of n-BA is 1. |