http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201003880-A

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filingDate 2009-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e2ac5aac83031ec55361d6e77551f0d
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publicationDate 2010-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201003880-A
titleOfInvention Semiconductor device comprising a chip internal electrical test structure allowing electrical measurements during the fabrication process
abstract A test structure or a circuit element acting temporarily as a test structure may be provided within the die region of sophisticated semiconductor devices, while probe pads may be located in the frame in order to not unduly consume valuable die area. The electrical connection between the test structure and the probe pads may be established by a conductive path including a buried portion, which extends from the die region into the frame below a die seal, thereby maintaining the electrical and mechanical characteristics of the die seal. Hence, enhanced availability of electrical measurement data and superior authenticity of the data may be accomplished, wherein the measurement data may be obtained during the production process.
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Total number of triples: 22.