http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201002859-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8a8bad24c6088d7a1deaa523dd4cfff7 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3473 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-31 |
| filingDate | 2009-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6140d9c27a3d51ff1d7660a208a27727 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abf113d9f54b410845c666b3f26cdd2c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4bc6fedca3ee855419f5d9e4a6847578 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba8ff8f4b2b7e52daa49f14f4888bda7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3aa389343128399237e8474c5a7aa79 |
| publicationDate | 2010-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201002859-A |
| titleOfInvention | Catalyst-imparting liquid for solder plating |
| abstract | A catalyst-imparting liquid which, when used in conducting electroless reductional solder plating directly on a copper-based conductor circuit material, can give an even coating film free from thickness unevenness and enables the formation of a solder deposit having no bridge between fine wiring lines. Also provided is a solder deposit formed using the catalyst-imparting liquid. The catalyst-imparting liquid, which is for conducting electroless reductional solder plating on a copper-based metal, is characterized by comprising a water-soluble gold compound and a chelating agent. The deposit is a solder deposit formed on a copper-based metal, and is characterized by being obtained by using the catalyst-imparting liquid to conduct electroless reductional solder plating. Furthermore provided is a solder deposit formed over a copper-based metal which has gold in an amount of 3x10-5 g/cm2 or smaller on the surface thereof, the deposit having been formed on the gold. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I508637-B |
| priorityDate | 2008-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 80.