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filingDate 2009-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_484aa8851b89f61c62677d2f7eeda646
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publicationDate 2010-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201001621-A
titleOfInvention Manufacturing method and manufacturing apparatus of semiconductor substrate
abstract It is an object to provide a homogeneous semiconductor substrate in which defective bonding is reduced. Such a semiconductor substrate can be formed by the steps of: disposing a first substrate in a substrate bonding chamber which includes a substrate supporting base where a plurality of openings is provided, substrate supporting mechanisms provided in the plurality of openings, and raising and lowering mechanisms which raise and lower the substrate supporting mechanisms; disposing a second substrate over the first substrate so as not to be in contact with the first substrate; and bonding the first substrate to the second substrate by using the raising and lowering mechanisms to raise the substrate supporting mechanisms.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9661718-B2
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