Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_81bbed339049c84138a09736b647d40e |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-535 |
filingDate |
2008-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4dd0bd2bb7cd175a892a3ee7119843b1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a193230f826fd0f33cd4201a230e6f6 |
publicationDate |
2010-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-201001618-A |
titleOfInvention |
Semiconductor structure and method for manufacturing the same |
abstract |
A semiconductor structure and a method for manufacturing the same. The method for manufacturing includes the following steps. Providing a silicon substrate. Etching the silicon substrate to form a ring hole and a silicon pillar surrounded by the ring hole. Disposing an insulating photosensitive material in the ring hole. Removing the silicon pillar such that a round hole is formed and the insulating photosensitive material is disposed on the sidewall of the round hole. Disposing a conductive material in the round hole and surrounded the conductive material. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102738072-A |
priorityDate |
2008-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |