| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3a4650d3658a94656a1bfda3e12bfbf5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-0118 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C99-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-02 |
| filingDate |
2009-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bbe86fe35905775a63b8f10d57b12b67 |
| publicationDate |
2010-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201000910-A |
| titleOfInvention |
Card for MEMS probe and method for manufacturing thereof |
| abstract |
A micro-electro-mechanical system (MEMS) probe card and a method for manufacturing the same are provided. The method includes preparing first to nth low temperature co-fired ceramic (LTCC) substrates each having a via hole, filling each via hole with a via filler conductor or a resistor, stacking the first to nth LTCC substrates and firing the stacked substrates at a temperature of 1, 000 DEG C or less to prepare a LTCC multilayer substrate, forming an insulating layer on the surfaces of the LTCC multilayer substrate, and forming a thin film conductive line on the surfaces of the insulating layer and the via filler conductor. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10506714-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I403620-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I563257-B |
| priorityDate |
2008-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |