| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e3b0a3dbf8d6c9712d86ea1383fd5327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1af4d0e685bf4c31f4371997df74aa35 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2913 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C9-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-01209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22F1-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-0016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B7-0045 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22D11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C9-00 |
| filingDate |
2009-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e312d278b99d401ca1d22d1297fe34b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c0913a85d462bf82e92818fdd7c69f4 |
| publicationDate |
2010-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201000650-A |
| titleOfInvention |
High strength and high electrical conductivity copper rod and wire |
| abstract |
This invention provides high strength and high electrical conductivity copper rod and wire, with its alloy having 0.12 to 0.32% Co by mass, 0.042 to 0.095% P by mass, 0.005 to 0.70 Sn by mass, 0.00005 to 0.0050 O by mass, wherein the content of % Co by mass [Co] and the content of % P by mass [P] is of a relationship 3.0 ≤ ([Co]-0.007)/([P]-0.008) ≤ 6.2, and the remainder being Cu and inevitable impurities. The material is mad by continuous casting and rolling procedures. The strength and electrical conductivity of the high strength and high electrical conductivity copper rod and wire is enhanced by the consistent precipitation of Co and P compound and the solidification of Sn. The cost is also reduced by adopting the continuous casting and rolling procedures. |
| priorityDate |
2008-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |