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publicationDate 2009-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200949912-A
titleOfInvention Plasma immersion ion implantation method using a pure or nearly pure silicon seasoning layer on the chamber interior surfaces
abstract Plasma immersion ion implantation employing a very high RF bias voltage on an electrostatic chuck to attain a requisite implant depth profile is carried out by first depositing a partially conductive silicon-containing seasoning layer over the interior chamber surfaces prior to wafer introduction.
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