http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200948843-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ead90443277482e25bf91bfddef2b5a7 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2009-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_efb5a731e9f6fe2bf77b1158aeff24d8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97958c7617122121448259d44335f7a5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8896389057e9be1306a662309cac1896 |
| publicationDate | 2009-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-200948843-A |
| titleOfInvention | Modified epoxy resin, epoxy resin compositions and cured articles |
| abstract | A modified epoxy resin which exhibits excellent handleability in a solid state at ordinary temperatures and exerts an excellently low viscosity at a molding temperature; epoxy resin compositions which each comprise the modified epoxy resin and an inorganic filler and which can give cured articles exhibiting high thermal conductivity, low thermal expansion, and excellent heat resistance and moisture resistance; and cured epoxy resin articles made by using the compositions. The modified epoxy resin can be prepared by reacting a mixture of hydroquinone and 4, 4'-dihydroxybiphenyl at a weight ratio of 0.1 to 10.0 with epichlorohydrin, and is in a crystalline state at ordinary temperatures. The epoxy resin compositions each comprises (A) an epoxy resin component, (B) a curing agent, and (C) an inorganic filler as the main components, with the epoxy resin component (A) containing the modified epoxy resin in an amount of 50wt% or above. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I426104-B |
| priorityDate | 2008-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 206.