http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200946675-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02057 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-37 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-33 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D1-22 |
filingDate | 2009-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9ae473615132f17d2d1a46ddb424cfd |
publicationDate | 2009-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | TW-200946675-A |
titleOfInvention | Washing agent for semiconductor device and method for washing semiconductor device using the same |
abstract | To provide a cleaning agent for use in a cleaning process after the planarizing process in a semiconductor device manufacturing process, capable of removing in a short time the organic contaminant and particle contaminant existing on the surface of the semiconductor devices, particularly on the surface of the semiconductor devices having copper wiring thereon, without subjecting the copper wiring to corrosion, and to provide a cleaning agent capable of highly cleaning the surface of the substrate and a cleaning method using it. The cleaning agents used after the chemical-mechanical polishing process of semiconductor devices having copper wiring on the surface in the semiconductor device manufacturing process, the polycarboxylic acid compound comprises a compound represented by formula (1): HOOC-R1-C(R2)=C(R3)COOH( wherein R1 represents a single bond or alkylene group, R2, R3 are each independently a hydrogen atom or an organic group, -R1COOH group and-COOH group having cis-configuration based on double bond). The cleaning agents is composed of the polycarboxylic acid compound, chelate agent, and anionic surfactant. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I580775-B |
priorityDate | 2008-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 133.