| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b01607e705336d4c0de8b9ac5f932497 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-243
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0387
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4269
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-106 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate |
2009-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_365be5832bf57afb6cddcf703378eddd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8cd85c71fecdd2163b9e36f37d542fd6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_053f0be38dfbd91c3fc0e32042871f6f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97be3f776932f59252ed027c087ecde0 |
| publicationDate |
2009-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200944563-A |
| titleOfInvention |
Method for manufacturing flexible wiring board |
| abstract |
Disclosed is a method for manufacturing a flexible wiring board. In the method, heat treatment for reacting a polyimide compound constituting a polyimide layer, on which a predetermined pattern has been formed by exposure and alkali developing treatment, with a crosslinking agent is performed under an atmosphere having an oxygen concentration of not more than 1% by volume. The heat treatment in the very low oxygen content of not more than 1% by volume can prevent a change in color in not only an exposed surface of a conductor circuit but also an interface between a conductor and the polyimide layer and can prevent the occurrence of the lifting of the polyimide layer after plating. |
| priorityDate |
2008-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |