http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200942971-A

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filingDate 2008-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8ce14d57c22ac7419b44969604a6fb5
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publicationDate 2009-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-200942971-A
titleOfInvention Photocurable resin composition, cured product pattern, and printed wiring board
abstract Disclosed is an alkali-developable photocurable resin composition, which is characterized by containing a carboxylic acid-containing photosensitive resin containing a structure represented by the general formula (I) below, a photopolymerization initiator (B), and a compound (C) containing two or more ethylenically unsaturated groups in a molecule. In the formula (I), R1 represents a hydrogen atom or a methyl group; R2 represents a linear, branched or cyclic alkyl having 2-6 carbon atoms; and R3 represents an acid anhydride residue.
priorityDate 2007-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 33.