| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9ec030fc062b270c25327af9127bed3a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c999fee6428152a996011d506925c2d7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0796 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4626
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0032 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate |
2008-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa50992b68a19550ebfa99d29789bb08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4db5a06977051adcdf089300c624827f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_549cd29b98c7de32b4c292f5bd971e3c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25971ba160680d3ab0d2ebc5330d84ed
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_31e025b8a4b35232fc8708c4d49118a9 |
| publicationDate |
2009-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200942117-A |
| titleOfInvention |
Production method of multilayer printed wiring board and multilayer printed wiring board |
| abstract |
The production method of the multilayer printed wiring board of the present invention includes forming a via hole by laser irradiation in insulating layer formed by a prepreg comprised of a glass cloth impregnated with a thermosetting resin composition, and subjecting the via hole to a glass etching treatment with a glass etching solution and then to a desmear treatment with an oxidizing agent solution. Due to such constitution, etch back phenomenon and excessive protrusion of glass cloth from the wall surface of a via hole can be sufficiently suppressed, and a highly reliable via can be formed. Particularly, a highly reliable via can be formed in a small via hole having a top diameter of 75 μ m or below. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I506082-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I405516-B |
| priorityDate |
2007-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |