| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b01607e705336d4c0de8b9ac5f932497 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-063
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0769
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4697
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-183 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate |
2009-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28df4f576530efe47afbbc9446198bc4 |
| publicationDate |
2009-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200942095-A |
| titleOfInvention |
Resist ink and method for manufacturing multilayer printed wiring board |
| abstract |
Disclosed is a resist ink having improved heat resistance and crack resistance. Also disclosed is a method for manufacturing a multilayer printed wiring board having a partially exposed inner layer, wherein the resist ink is used. Specifically disclosed is a resist ink containing at least one member selected from the group consisting of tetracarboxylic acids, tetracarboxylic acid dianhydrides and half esterified tetracarboxylic acid dianhydrides, a polyhydric alcohol having three or more hydroxyl groups in a molecule, and a filler. The resist ink is soluble in an alkaline solution. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8516694-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9282626-B2 |
| priorityDate |
2008-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |