| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09781
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0969
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09318
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-189
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10674 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-30 |
| filingDate |
2008-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d748fe623f83a144f218894f80f21741
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1a87657aaedf11f32d6776b02933ed2 |
| publicationDate |
2009-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200942092-A |
| titleOfInvention |
Printed circuit board and method of manufacturing the same |
| abstract |
A mounting region is provided at an approximately center of one surface of an insulating layer. A conductive trace is formed so as to outwardly extend from inside of the mounting region. A cover insulating layer is formed in a periphery of the mounting region so as to cover the conductive trace. A terminal of the conductive trace is arranged in the mounting region, and a bump of an electronic component is bonded to the terminal. A metal layer made of copper, for example, is provided on the other surface of the insulating layer. A pair of slits is formed in the metal layer such that a region being opposite to the electronic component is sandwiched therebetween. Each slit is formed so as not to divide the metal layer into a plurality of regions. |
| priorityDate |
2008-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |