patent/TW-200940748-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200940748-A

Outgoing Links

Predicate	Object
assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-383 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49582 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-50
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3142 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-28
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-44
filingDate	2008-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_364b8b26613a0405b68bec2a1d5b81a2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b7840406fa2b63d77c48510018387d4d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a905372fee2dbfb75471d58cb6688de
publicationDate	2009-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	TW-200940748-A
titleOfInvention	Adhesion promotion
abstract	Methods for etching nickel and nickel alloy layers are disclosed. The etching compositions include inorganic acids and heterocyclic nitrogen compounds. Additionally, the etching methods may include anodic etching of nickel or nickel alloy layer. The methods may be used in semiconductor packaging manufacture.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8829356-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9232665-B2
priorityDate	2007-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID412550040 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID935

Total number of triples: 37.