http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200940599-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d942b2f8b0e063112305213bdd69978c |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F8-48 |
| filingDate | 2008-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9abde71606750016cc1bd4a41960ca7c |
| publicationDate | 2009-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-200940599-A |
| titleOfInvention | Method for producing polyimide solution and slurry thereof |
| abstract | This invention provides a method for producing a polyimide solution andits slurry. The method includes the following steps of dissolving dianhydrides and diamines in organic solvents to prepare polyamic acid solution, and then reacting under a reduced pressure with continuous vacuum pumping to directly form polyimide solution or polyimide slurry, wherein the status of polyimide solution or polyimide slurry is different from the general solid polyimide dissolved in organic solvents. The polyimide solution or slurry may form cross-linked network structure bulk materials or films together with other resins such epoxy resin. Alternatively, the polyimide solution or slurry may be directly taken as varnish or be coated on electronic facilities or a flexible printed circuit board to form a cladding layer. Accordingly, the polyimide resin film can be conveniently formed; or the polyimide resin can be directly produced by removing solvent. |
| priorityDate | 2008-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 93.