| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5ac17835c97e6c72213815ca74845386 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C2222-20 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-52 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C22-52 |
| filingDate |
2009-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e373d71f3a00d8742fe88bcbae42255 |
| publicationDate |
2009-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200938657-A |
| titleOfInvention |
Copper surface treatment agent and copper surface treatment method |
| abstract |
Provided is a copper surface treatment agent comprising a tin compound, a complexing agent, and a silane coupling agent, and a surface treatment method whereby a copper surface can be treated so as to achieve a smooth state without performing a roughing process such as etching and close adhesion between the copper and an insulating material such as a resin can be maintained, without increasing the number of processing steps. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11472823-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I679305-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I423742-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I423743-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I466609-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11014946-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112064003-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112064003-B |
| priorityDate |
2008-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |